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7th International Congress on Architectural Envelopes (ICAE 2015)

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7th International Congress on Architectural Envelopes (ICAE 2015)

27th May 2015 - 29th May 2015

TECNALIA Research & Innovation hosts the VII International Congress on Architectural Envelopes (ICAE 2015) on 27, 28 and 29 May 2015. The event, which is held every 3 years, will take place at the Kursaal Congress Center at Donostia-San Sebastian (Spain).

The main topic of the Congress will be related to “Smartization”, or the introduction of new technologies in Architectural Envelopes.

This topic will be the driving force for this Congress since envelopes are becoming increasingly important as core elements in the relationship between buildings and their environment. Likewise, it is thought that this relationship must be as dynamic as possible, allowing the envelope to react and adapt to the external and internal conditions, thus improving its performance and that of the building itself. To this end, it is essential for the envelope to receive information from its entire environment, opening and closing sections, modifying its thermal performance, changing its geometric configuration, darkening areas, etc. This “dynamization” of the performance of the envelope is starting to be explored by means of new technologies and systems that allow to learn about all these parameters and react accordingly.

For this purpose, the main goal of the Congress is to address this process; its advantages, drawbacks, problems, benefits, etc. and the way in which they must adapt, evolve or complement current systems.

Details

Start:
27th May 2015
End:
29th May 2015
Website:
http://www.icae2015.com/en/

Organizer

TECNALIA

Venue

Auditorium Kursaal
Donostia - San Sebastián, Spain + Google Map

Funding

This project has received funding from the European Union's Seventh Framework Programme for research, technological development and demonstration under grant agreement no 285689.